Verdin AM62
Getting Started
Verdin AM62 is a member of the Verdin Family. You will find all technical details such as features, datasheets, software, etc. here.
Recommendation for a first-time order
For starting for the first time with your Verdin AM62 you will need a suitable Verdin carrier board as well as some adapters and cables for connecting your desired interfaces.
Toradex recommends ordering one of the following carrier boards for your first-time order:
Where do I buy this product?
You will find availability and purchase information for Verdin AM62 module, Yavia, Dahlia Carrier Board and Verdin Development Board on the Toradex webshop.
Getting started for the first time?
The Verdin AM62 provides an experience similar to other members of the Verdin Family, with Toradex Easy Installer pre-installed, and step-by-step instructions about how to start using Torizon in our Quickstart Guide.
Verdin AM62 step-by-step Quickstart
For detailed instructions about how to start developing your software for this Computer on Module, check out our software page.
The following Linux-based offerings will be supported soon:
Yocto Project Reference Images - binary images built with Toradex reference recipes, a great starting point for customized Linux images. Support for Verdin AM62 was introduced on version 6.4.
Torizon OS - open source easy-to-use industrial Linux operating system. Support for Verdin AM62 was introduced on version 6.4.
Datasheets
Verdin AM62 V1.1 datasheetDesign Resources
Verdin Specifications
3D Models
Toradex provides two different 3D models for Verdin Systems on Module:
- Generic Verdin 3D Mechanical Models: This model has the maximum component height for testing the mechanical fit. This ensures the mechanical design fits all current Verdin modules as well as future releases.
- Specific Verdin 3D Mechanical Models: These models are simplified models of the respective Verdin module. They contain only the PCB and the CPU and are intended to be used for heat spreader or heat sink designs. The CPU height is a typical value. Due to production tolerances, the actual height of the assembled component can be different.
Generic Verdin 3D Mechanical Models
The generic Verdin 3D model contains the PCB and the maximum component height on top and bottom of modules from the Verdin Module Family. This model should be used to test the mechanical fit, ensuring that the mechanical design fits all current Verdin modules as well as future releases.
- SolidWorks CAD model 3D EASM model
- You can download the free eDrawings model viewer from SolidWorks here
- 3D STEP model that can be opened and modified in any 3D CAD
- 3D PDF model that can be opened in Adobe Reader
Verdin AM62 - Specific 3D Mechanical Models
The Verdin AM62 Plus 3D model is simplified and contains only the PCB and the CPU. It is intended to be used for heat spreader or heat sink designs. The CPU height is a typical value. Due to production tolerances, the actual height of the assembled component can be different. Please use the Generic Verdin 3D Mechanical Models with the maximum component height for testing the mechanical fit. This ensures the mechanical design fits all current Verdin modules as well as future releases.
- SolidWorks CAD model 3D EASM model
- You can download the free eDrawings model viewer from SolidWorks here
- 3D STEP model that can be opened and modified in any 3D CAD
- 3D PDF model that can be opened in Adobe Reader
Carrier Boards
Off-the-shelf Carrier Boards
Learn more on the Verdin Product Family Specification Update.
Custom Carrier Board Design
Find free reference designs, schematics, 3D designs, and tools to build your carrier board easily in the link below:
Upverter
Upverter is an online carrier board design tool that simplifies carrier board design and software support at the BSP level. The tool is available on the Toradex developer website:
Accessories
- Verdin DSI to HDMI Adapter
- Verdin DSI to LVDS Adapter
- Verdin DSI Display Adapter
- Verdin Industrial Heatsink
- Chang Hong DA-2458-02 RP-SMA
- Antenna Cable U.FL to RP-SMA
- Capacitive Touch Display 10.1" LVDS (through Verdin DSI to LVDS adapter)
- Capacitive Touch Display 10.1" DSI (only Verdin AM62 configurations that with MIPI DSI output)
Revision History
Click to See the Product Numbering Scheme
Product Number (PID8) Format
The format of the 8-digits Product Number (PID8) is the following:
The below table describes the structure of the Product Number (PID8):
| Field | Description |
|---|---|
| PPPP | 4-digits number, indicating the Product Configuration (PID4) that describes the key properties of the product (e.g. Product Group, RAM capacity, etc.) |
| VV | 2-digits number, indicating the Major and Minor Version (in that order) |
| AA | 2-digits number, indicating the Assembly Variant |
See the complete list of available combinations on the Revision History table of the corresponding product page.
Example
Product number (PID8): 00291100:
0029: Apalis iMX6D 512MB11: Major Version 1, Minor Version 1, Version V1.1 in short
00: Assembly Variant A
A specific product revision has a lifecycle defined by the product state. Learn more about it on the Product Change Notifications.
0076 Verdin AM62 Quad 2GB WB IT
| Product # | Product Description | Changes from Previous Version | Release Date | Related Documents |
| 00761100 | Verdin AM62 Quad 2GB WB IT V1.1A | Initial Release | Q3 2023 | None |
| 00761101 | Verdin AM62 Quad 2GB WB IT V1.1B | - PCB manufacturer change to the volume PCB manufacturer - Change RAM from Micron MT53E1G16D1FW-046 AIT:A to MT53E1G16D1ZW-046 AIT:C | Q2 2024 | None |
| 00761102 | Verdin AM62 Quad 2GB WB IT V1.1C | PCB manufacturing update to solve and mitigate Errata #4: HAR-10889 – A manufacturing issue might affect the V1.1B functionality | Q2 2024 | Verdin AM62 Errata |
| 00761200 | Verdin AM62 Quad 2GB WB IT V1.2A | - Changed RBIAS resistor on Ethernet PHY from 10k to 11k per TI recommendation - Design improvements related to supporting Suspend-to-RAM functionality - Added a dedicated LDO with enable pin for supplying VPP voltage which is used for fusing the OTP memory of AM62 SoC - Improvements to the JTAG circuitry - Added compatibility for TPM 2.0 with possibility to use SPI via carrier board loopback or I2C on SoM - Maya-W1 input voltage change to 3V3 solving Errata #5: HAR-110989 – The Verdin AM62 MAYA-W1 input voltage is higher than the reccomended absolute maximum rating | Q3 2024 | Verdin AM62 Errata |
0075 Verdin AM62 Dual 1GB WB IT
| Product # | Product Description | Changes from Previous Version | Release Date | Related Documents |
| 00751100 | Verdin AM62 Dual 1GB WB IT V1.1A | Initial Release | Q3 2023 | None |
| 00751101 | Verdin AM62 Dual 1GB WB IT V1.1B | PCB manufacturer change to the volume PCB manufacturer | Q2 2024 | None |
| 00751102 | Verdin AM62 Dual 1GB WB IT V1.1C | PCB manufacturing update to solve and mitigate Errata #4: HAR-10889 – A manufacturing issue might affect the V1.1B functionality | Q2 2024 | Verdin AM62 Errata |
| 00751200 | Verdin AM62 Dual 1GB WB IT V1.2A | - Changed RBIAS resistor on Ethernet PHY from 10k to 11k per TI recommendation - Design improvements related to supporting Suspend-to-RAM functionality - Added a dedicated LDO with enable pin for supplying VPP voltage which is used for fusing the OTP memory of AM62 SoC - Improvements to the JTAG circuitry - Added compatibility for TPM 2.0 with possibility to use SPI via carrier board loopback or I2C on SoM - Maya-W1 input voltage change to 3V3 solving Errata #5: HAR-110989 – The Verdin AM62 MAYA-W1 input voltage is higher than the reccomended absolute maximum rating | Q3 2024 | Verdin AM62 Errata |
0074 Verdin AM62 Dual 1GB IT
| Product # | Product Description | Changes from Previous Version | Release Date | Related Documents |
| 00741100 | Verdin AM62 Dual 1GB IT V1.1A | Initial Release | Q3 2023 | None |
| 00741101 | Verdin AM62 Dual 1GB IT V1.1B | PCB manufacturer change to the volume PCB manufacturer | Q2 2024 | None |
| 00741102 | Verdin AM62 Dual 1GB IT V1.1C | PCB manufacturing update to solve and mitigate Errata #4: HAR-10889 – A manufacturing issue might affect the V1.1B functionality | Q2 2024 | Verdin AM62 Errata |
| 00741200 | Verdin AM62 Dual 1GB IT V1.2A | - Changed RBIAS resistor on Ethernet PHY from 10k to 11k per TI recommendation - Design improvements related to supporting Suspend-to-RAM functionality - Added a dedicated LDO with enable pin for supplying VPP voltage which is used for fusing the OTP memory of AM62 SoC - Improvements to the JTAG circuitry - Added compatibility for TPM 2.0 with possibility to use SPI via carrier board loopback or I2C on SoM | Q3 2024 | None |
0073 Verdin AM62 Dual 1GB ET
| Product # | Product Description | Changes from Previous Version | Release Date | Related Documents |
| 00731100 | Verdin AM62 Dual 1GB ET V1.1A | Initial Release | Q3 2023 | None |
| 00731101 | Verdin AM62 Dual 1GB ET V1.1B | - PCB manufacturer change to the volume PCB manufacturer - Remove Temperature Sensor | Q2 2024 | None |
| 00731102 | Verdin AM62 Dual 1GB ET V1.1C | PCB manufacturing update to solve and mitigate Errata #4: HAR-10889 – A manufacturing issue might affect the V1.1B functionality | Q2 2024 | Verdin AM62 Errata |
| 00731200 | Verdin AM62 Dual 1GB ET V1.2A | - Changed RBIAS resistor on Ethernet PHY from 10k to 11k per TI recommendation - Design improvements related to supporting Suspend-to-RAM functionality - Added a dedicated LDO with enable pin for supplying VPP voltage which is used for fusing the OTP memory of AM62 SoC - Improvements to the JTAG circuitry - Added compatibility for TPM 2.0 with possibility to use SPI via carrier board loopback or I2C on SoM | Q3 2024 | None |
0072 Verdin AM62 Solo 512MB WB IT
| Product # | Product Description | Changes from Previous Version | Release Date | Related Documents |
| 00721100 | Verdin AM62 Solo 512MB WB IT V1.1A | Initial Release | Q3 2023 | None |
| 00721101 | Verdin AM62 Solo 512MB WB IT V1.1B | - Change SoC from Texas Instruments AM6231ASGGGAALW to AM6231ASGGHAALW (SoC with HSFS - Secure SoC) - PCB manufacturer change to the volume PCB manufacturer | Q2 2024 | None |
| 00721103 | Verdin AM62 Solo 512MB WB IT V1.1D | PCB manufacturing update to solve and mitigate Errata #4: HAR-10889 – A manufacturing issue might affect the V1.1B functionality | Q2 2024 | Verdin AM62 Errata |
| 00721200 | Verdin AM62 Solo 512MB WB IT V1.2A | - Changed RBIAS resistor on Ethernet PHY from 10k to 11k per TI recommendation - Design improvements related to supporting Suspend-to-RAM functionality - Added a dedicated LDO with enable pin for supplying VPP voltage which is used for fusing the OTP memory of AM62 SoC - Improvements to the JTAG circuitry - Added compatibility for TPM 2.0 with possibility to use SPI via carrier board loopback or I2C on SoM - Maya-W1 input voltage change to 3V3 solving Errata #5: HAR-110989 – The Verdin AM62 MAYA-W1 input voltage is higher than the reccomended absolute maximum rating - PMIC fusing change to reduce VDD_CORE voltage to 0.75V for improved power consumption | Q3 2024 | Verdin AM62 Errata |
0071 Verdin AM62 Solo 512MB
| Product # | Product Description | Changes from Previous Version | Release Date | Related Documents |
| 00711100 | Verdin AM62 Solo 512MB V1.1A | Initial Release | Q3 2023 | None |
| 00711101 | Verdin AM62 Solo 512MB V1.1B | - Change SoC from Texas Instruments AM6231ASGGGAALW to AM6231AKGGHHALW (SoC with HSFS - Secure SoC) - PCB manufacturer change to the volume PCB manufacturer - Remove Temperature Sensor | Q2 2024 | None |
| 00711102 | Verdin AM62 Solo 512MB V1.1C | PCB manufacturing update to solve and mitigate Errata #4: HAR-10889 – A manufacturing issue might affect the V1.1B functionality | Q2 2024 | Verdin AM62 Errata |
| 00711200 | Verdin AM62 Solo 512MB V1.2A | - Changed RBIAS resistor on Ethernet PHY from 10k to 11k per TI recommendation - Design improvements related to supporting Suspend-to-RAM functionality - Added a dedicated LDO with enable pin for supplying VPP voltage which is used for fusing the OTP memory of AM62 SoC - Improvements to the JTAG circuitry - Added compatibility for TPM 2.0 with possibility to use SPI via carrier board loopback or I2C on SoM - PMIC fusing change to reduce VDD_CORE voltage to 0.75V for improved power consumption | Q3 2024 | None |
Errata/Known issues
SoC Errata
SoM Errata Documents
Hardware Errata/Known issues
Issue trackers are not yet available in the new developer website. See it on the archived developer website.