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MXM3

 

Article updated at 04 Jan 2021
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The Apalis module fits into a regular Mobile PCI Express Module from second generation, usually referred to as MXM3. A choice of MXM3 socket manufacturers and distributors is given below. Please also consult the section 4.1 of the Apalis Carrier Board Design Guide for more information.

MXM3 Connectors

Manufacturer Part Number Spacer height Footprint compatibility Remarks
JAE MM70-314-310B1-x 3mm Compatible with reference footprint (the device has 310 pins instead of 314). The device was replaced by MM70-314B1-2-R300 from JAE due to obsolescence. You should not use it anymore, and if you have designs with it, consider updating them.
Learn more on JAE's Marketing Bulletin - MM70 Series Replacement Release from October 6, 2020.
Toradex carrier boards that use this connector
JAE MM70-314B1-2-R300 3mm Reference footprint is based on this device. This is the new connector that replaced MM70-314-310B1-x on the new reference boards.
Learn more on JAE's Marketing Bulletin - MM70 Series Replacement Release from October 6, 2020.
Official distribution channels for this connector are TTI and Rutronik
At the moment, the connector datasheet is under NDA and you must contact JAE to get it. Other documents are publicly available:
Technical Drawing No. SJ121700 - version 1
Technical Drawing No. SJ121699 - version1
Comparison: MM70-314-310B1-1-R300 vs MM70-314B1-2-R300
Toradex carrier boards that use this connector
JAE MM70-314-310B2-x 1.5mm Different position of alignment post. Not recommended for Apalis, since spacer height is too small. Components on the bottom can be up to 1.8mm.
ACES 91781-314xx-xxx 2.7mm Different position of alignment post. SnapLock not possible for this spacer height. Module needs to be screwed down.
ACES 91782-314xx-xxx 5mm Different position of alignment post. SnapLock not possible for this spacer height. Module needs to be screwed down.
Attend 125B-78C00 5mm Different position of alignment post. Different insertion depth of the module. SnapLock not possible for this spacer height. Module needs to be screwed down.
Foxconn AS0B826-S43B-7H 1.5mm Different position of alignment post. Not recommended for Apalis, since spacer height is too small. Components on the bottom can be up to 1.8mm.
Foxconn AS0B826-S55B-7H 2.7mm Different position of alignment post. SnapLock not possible for this spacer height. Module needs to be screwed down.
Foxconn AS0B826-S78B-7H 5mm Different position of alignment post. SnapLock not possible for this spacer height. Module needs to be screwed down.
Speedtech B35P101-0xx1x-H 1.56mm Different position of alignment post. Not recommended for Apalis, since spacer height is too small. Components on the bottom can be up to 1.8mm.
Speedtech B35P101-0xx2x-H 2.76mm Different position of alignment post. SnapLock not possible for this spacer height. Module needs to be screwed down.
Speedtech B35P101-0xx3x-H 5.06mm Different position of alignment post. SnapLock not possible for this spacer height. Module needs to be screwed down.
Yamaichi CNU113-314-220x-VE 5mm Different position of alignment post. Automotive graded with Latch Lock. SnapLock not possible for this spacer height. Module needs to be screwed down.
Nexus Components B242-C-B-X 5mm Different position of alignment post, additional alignment post in the centre of the connector. SnapLock not possible for this spacer height. Module needs to be screwed down.

Toradex Carrier Boards

This section contains the versions of our carrier boards that have been redesigned, among other things, to accommodate the update from JAE MM70-314-310B1-x (end-of-life) to JAE MM70-314B1-2-R300. The table contains hyperlinks to the product pages, where you can find out more on the revision history tab, and also get the schematics and design resources:

Carrier Board Version with JAE MM70-314-310B1-x Version with JAE MM70-314B1-2-R300
Apalis Evaluation Board V1.1C and older V1.2A and newer*
Ixora Carrier Board V1.2A and older V1.3A and newer*
  • As of January 2021, Apalis Evaluation Board V1.2A and Ixora Carrier Board V1.3A are still in development and, therefore, not yet available.